
Resolving Test Challenges for High-Speed Interfaces
July 2009
By: Paul F. Scrivens, Johnstech
Resolving test challenges for emerging wireless designs
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April 2009
By: Paul F. Scrivens, Johnstech
BiTS 2009
Attendee Choice Award Winner
Pulsed Current-Carrying Capacity of Small Metallic Conductors as applied to Device Test
Chip Scale Review
November/December 2008 Article
Cost of Test is not the only Factor to Consider in Production Test
BiTS 2006 Award Winning Paper
Best Data Presented
Socket Performance Over Time & Insertion Count with Pb-Free Applications
Understanding How Pb-Free Platings Affect Production-Test Cost, Throughput and Yield
Challenges of Contacting Lead-Free Devices
RF Wireless and High Speed Digital Test Issues and Your Contactor Supplier
Orchestrating Four ATE Suppliers To Reduce Test Cost For A High-Volume RF-IC
Optimizing the Whole Test System to Achieve Optimal Yields and Lowest Test Costs *
* This paper is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the products or services of Johnstech International Corporation. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
