How to Improve OEE with Contactor Maintenance and Set-Up Checks

by Eugene Batilo, Sales Engineer

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Understanding Specs to Better Simulate Solder-to-Board Performance

Presented at the BiTS Workshop, March 2012
by: Jeff Sherry, PE, MSEE, Senior RF Engineer

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Configurable Kelvin Technology for Test Optimization

by Jeff Sherry, PE, MSEE

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CCC: What is it and Why is it Important to Your Test Times and Yields?

by Harlan L. Faller, PE, MSEE and Jeff Sherry, PE, MSEE

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Monte Carlo Simulation and Design of Experiments for Improved Pin-Pad Alignment

Presented at the BiTS Workshop, March 2011
by: John DeBauche, Engineer Manager

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Can Your Socket Handle the Heat?

Published in Chip Scale Review, March 2011
by: Jeff Sherry, PE, MSEE, Senior RF Engineer

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Thermal Modeling and Analysis of Device-Contactor-Load Board System

by Harlan Faller, PE, Advanced Senior Technologist

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Choosing Pulse Parameters for High Current Testing

by Harlan L. Faller, PE, Lead

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Designing the Optimal Board for IC Testing

Published in EE-Evaluation Engineering, September 2010
By Jeff Sherry, PE, MSEE, Senior RF Engineer

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Pulsed Current-Carrying Capacity of Small Metallic Conductors as applied to Device Test

Presented at the BiTS Workshop, March 2009
Attendee Choice Award Winner

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Cost of Test is not the only Factor to Consider in Production Test

Published in Chip Scale Review, November 2008

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Socket Performance Over Time & Insertion Count with Pb-Free Applications

Presented at the BiTS Workshop, March 2006
Award Winning Paper: Best Data Presented

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Resolving test challenges for emerging wireless designs

Understanding How Pb-Free Platings Affect Production-Test Cost, Throughput and Yield

Challenges of Contacting Lead-Free Devices

RF Wireless and High Speed Digital Test Issues and Your Contactor Supplier

Orchestrating Four ATE Suppliers To Reduce Test Cost For A High-Volume RF-IC

Optimizing the Whole Test System to Achieve Optimal Yields and Lowest Test Costs *

* This paper is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the products or services of Johnstech International Corporation. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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