Electrical Modeling
Thermal Analysis
PCB Evaluations
Test Cell Integration
Test Floor

Electrical Modeling

Our system-level approach integrates the components, device, load board and Contactor into a single interrelated and integrated electronic system. Modeling allows you to simulate actual signal performance of the system. A typical application of our services, your S-parameter data files are imported into Advanced Design Systems (ADS) to simulate actual signal performance in the Contactor. To account for potential electrical performance, High Frequency Structure Simulator (HFSS) simulations are conducted to measure variations attributable to PCB trace routing, pad placement or effects of manufacturing tolerance, as well as base material changes. The simulations provide a 3-D analysis of scenarios, exposing potential signal distorting risks or enhancement opportunities. These modeling and simulation techniques, along with our experienced professional RF engineers, allow us to measure anticipated crosstalk, insertion loss, amplifier gain, susceptibility to ground inductance and isolation, and other variables.

Thermal Analysis

As high-performance device technology such as cell phones become more sophisticated, thermal issues associated with heat generation and transfer consume an increasing percentage of engineering time and effort. Failure to adequately dissipate excess heat dramatically affects overall device performance. Modeling and implementing thermal control solutions before they arise in package considerations means ATE test fixturing can result in significant time and cost savings for the test development engineer — as well as on the manufacturing floor.

Johnstech offers consulting services that provide comprehensive system thermal analysis for die-package, package – Contactor, Contactor – load board, and system-to-ambient. With a complete understanding of the thermal theory and proven modeling success, the Johnstech team integrates reality with theory to achieve success. Our customers enjoy reliable product launches, tighter guard bands, quicker time-to-market, and higher first pass yields, ensuring maximum profitability. Whether you are in the pre-development or production stage, Johnstech’s thermal consulting services will make certain your product is not unduly ‘taking the heat.’

Each situation is unique, with a myriad of device, package, contactor and load board characteristics. Our knowledgeable, experienced and professional thermal engineering staff works closely with you, carefully analyzing each application to ensure that you meet or exceed the device/package thermal limitations.

Johnstech’s Thermal Analytical services is just one of a family offered by the industry’s recognized leader in high-performance contacting.

PCB Evaluations

Physical Load Board Evaluation & Testing

Johnstech conducts an evaluation of the plating, a physical measurement of the plating thickness, a check of the tolerancing of alignment tooling holes, and an inspection of the contact-to-pad alignment.  Customers may request this in an evaluation situation, after first run of the board, or as diagnostics related to a problem.

Load Board Optimization/Design Consulting Services

Johnstech may provide load board assistance such as getting 50 ohms to the device, impedance matching, designing for impedance, or other information. A scope of work is required, including application requirements.

Load Board Design Evaluation

This may occur pre or post-board design. Johnstech evaluates the board layout as it applies to a particular application and makes recommendations to optimize it.

Test Cell Integration

You need to tune your electrical and mechanical applications to maximize first pass yield and optimize throughput.  Look no further than Johnstech, which has charted the course for custom contact integration for Automatic Test Equipment (ATE) with a Contactor-device-handler design matrix applied successfully in more than 5,000 designs. Our sales staff and applications engineers work closely with each customer to insure that every application has been carefully tuned electrically and mechanically to meet or exceed device and handler requirements.

When reviewing your ATE requirements, remember that Johnstech is the leader for maximum yields, throughput, and the industry’s highest OEE’s. We understand docking, Contactor and handler integration like no other company.

Each design contains:

  • Design-specific data sheet
  • Parts list
  • Spares list
  • Contactor layout
  • Alignment plate layout if applicable
  • Load board footprint
  • PCB footprint layout documentation
  • Electrical and mechanical specifications
  • Third-party S parameter analysis
  • Maintenance and inspection guides
  • Technical application notes
  • Handler application notes

Test Floor

Many electrical and mechanical issues can impact your first pass yield and reach all the way to the bottom line. Johnstech works with you with a comprehensive set of FPY enhancement services ideal for your test floor.

Our field engineers combine a hands-on approach with sophisticated yield loss analysis and diagnosis to uncover the root causes of contactor, handler, load board, docking or Z-stack problems that impact FPY and profitability.

The result: some of the highest FPY and up-binning in the industry. Test floors are rewarded with some of the longest MTBAs, shortest MTTRs and highest OEE improvements that directly increase profitability and reduce overhead costs.

We address your specific situation, working with handlers, testers, docking, contactors, positioning, load board configurations and devices, tuning each application electrically and mechanically to meet and or exceed device and handler requirements.

To boost your yields, throughputs, and test floor efficiency remember Johnstech. We understand docking, contactor and handler integration like no other company.

Driving down your test costs

Johnstech contactors are combined with Johnstech Engineering Services and Technical Support, you will see your already high performance achieve an even higher level helping you to reduce development time, transfer test seamlessly to production, increase yields and overall equipment efficiency.

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